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High Performance, Dual Thermal and Visible OEM Camera Module
Hadron 640R
Model: Hadron 640R (Radiometric)
The ITAR-free Hadron™ 640 series pairs a 64MP visible camera with a performance-leading 640×512 resolution radiometric Boson® or Boson+ thermal camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and emerging AI applications utilizing Teledyne FLIR Prism™ software.
Overview
Product
Description
Documents
Training
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Description
Hadron 640 models share mechanical and electrical interfaces simplifying design. Compatible with Teledyne FLIR’s Prism AI detection, tracking, and classification models and Prism ISP libraries for super-resolution, turbulence mitigation, contrast enhancement, and more, Hadron 640 series enables effective AI-based applications. With drivers available for market leading processors from NVIDIA®, Qualcomm®, and more plus industry-leading integration support, Hadron 640 also reduces development cost and shortens time to market.
Evaluate Prism with the Hadron 640R using the Prism Development Kit for Qualcomm RB5 today.
Evaluate Prism with the Hadron 640R using the Prism Development Kit for Qualcomm RB5 today.
Documents
Training
Downloads
Media
Accessories
Datasheet
Quick Start Guide
Getting Started with
NVIDIA Jetson Nano
Getting Started with
Qualcomm RB5
XPONENTIAL 2023 feat. Hadron 640R Dev Kits for NVIDIA and Qualcomm
Industry-Leading Thermal and Visible Camera Performance
Collect high-speed, VGA radiometric thermal and HD visible imagery.
Built for
Integrators
Reduce development cost and time to market with solution from a single, reliable supplier.
Size, Weight, and Power (SWaP) Optimized Design
Optimize design and operation time with compact, lightweight, and low-power module.
Teal 2 sUAS Overview feat. Hadron 640R
INTEGRATE THERMAL FASTER
Integrating Teledyne FLIR thermal camera modules is now easier with our library of how-to-videos, application notes, and our comprehensive support center with product drawings, datasheets, and more!
WHAT IS THERMAL BY FLIR?
Thermal by FLIR is a cooperative product development and marketing program that supports original equipment manufacturers (OEMs) and product innovators who use FLIR thermal imaging sensors in their products. With Thermal by FLIR, let us help you create the next market-changing innovation to grow your business.
Prism
The end-to-end computational imaging ecosystem that supports various AI-powered object detection and tracking capabilities and advanced image processing.
INNOVATE WITH THE INDUSTRY'S BEST CORES
With industry-leading reliability, performance, size, weight, and power, they are ideal for defense, commercial, and security applications.
Camera Model
Selector
Sorting through more than 100+ models can be tricky. Try our “Camera Model Selector” to find the right solution.
Specifications
| PARAMETERS | DESCRIPTION |
|---|---|
| Thermal Imaging Detector | Boson 640×512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI, Radiometric |
| Temperature Accuracy | ±5 °C less, over 0 °C to 100 °C range. |
Radiometry
| Temperature Accuracy | ±5 °C less, over 0 °C to 100 °C range. |
Imaging & Optical
| EO Camera Optics | Effective Focal Length (EFL) 4.8 mm, 67° HFOV, F/# 1/2.3 |
| EO Camera Sensor | 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI |
| EO Camera Video | Full resolution @ 60 Hz |
| IMU | ICM20602, I2C or SPI (selectable) |
| IR Camera Optics | EFL 13.6mm, 32° HFOV, F/# 1.0 |
| IR Camera Video | Full resolution @ 60Hz |
| Thermal Imaging Detector | Boson 640×512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI, Radiometric |
| Thermal Sensitivity | <40 mK |
Connections & Communications
| Software Drivers | NVIDIA Jetson Nano Qualcomm Snapdragon rb5 Qualcomm Snapdragon 865 *Contact Teledyne FLIR for latest software drivers |
Electrical
| Electrical Interface | Hirose DF40C-50DP-0.4V (51) Example of mating connector: DF40HC(2.5)-50DS-0.4V (51) |
| Power | 5V supply voltage. Typical power dissipation < 1800mW, Max < 2900mW |
Mechanical
| Mechanical Interface | Screw mount to back plate |
| Size (w/o lens) | 35 x 49 x 45 mm (1.38” x 1.93” x 1.77”) |
| Weight | 56g |
Environmental & Approvals
| Environmental Sealing | IP54 (with the rear interfaces sealed) |
| Operational & Storage Temperature | -20°C to +60°C |
| Tested EMI Performance | FCC part 15 Class B |
Environmental & Approvals
| ECCN Code | 6A003.b.4.b (Fast Video, 60Hz) 6A993.A (Slow Video, 9Hz) |
