SWaP-Optimized SOM for Prism

FLIR AVP

The AVP, a size, weight, and power (SWaP) optimized advanced video processor, provides best-in-class artificial intelligence performance for thermal infrared and visible camera perception systems. It incorporates the latest Qualcomm® QCS8550, the industry’s most advanced mobile processor system on chip (SoC) featuring up to 48 TOPS inference compute performance. The QCS8550 is part of Qualcomm’s Product Longevity Program, ensuring future-proof product stability.

Overview

Product

Datasheet

FLIR AVP - Datasheet

Industry-Leading Size, Weight, and Power (SWaP) Consumption

Run Prism AI and ISP on the highest-performance QCS8550 SoC in the industry

FUTURE PROOF
YOUR DESIGN

Flexible hardware is part of the Qualcomm Product Longevity Program

BUILT FOR
INTEGRATORS

Simplify development and reduce risk with Prism software and support
Teal 2 sUAS Overview feat. Hadron 640R
Prism

The end-to-end computational imaging ecosystem supports various AI-powered object detection and tracking capabilities and advanced image processing.

THE TELEDYNE FLIR ADVANTAGE

Integrating Teledyne FLIR thermal camera modules is now easier with our library of how-to-videos, application notes, and our comprehensive support center with product drawings, datasheets, and more!

INNOVATE WITH THE INDUSTRY'S BEST CORES

With industry-leading reliability, performance, size, weight, and power, they are ideal for defense, commercial, and security applications.

Prism

The end-to-end computational imaging ecosystem that supports various AI-powered object detection and tracking capabilities and advanced image processing.

Camera Model
Selector

Sorting through more than 100+ models can be tricky. Try our “Camera Model Selector” to find the right solution.

Specifications

PARAMETERS DESCRIPTION

General

Memory 16GB LPDDR5x
Part Number SOM 4251537 Devkit Part Number: 421-0100-00
Processor Qualcomm QCS8550
64-bit Octa-Core
Application processor at 3.2 GHz (Gold+), 2.8GHz (4 x Gold), 2.0GHz (3 x Silver) Qualcomm Kryo CPU
Qualcomm Adreno GPU 740
Qualcomm Hexagon Tensor Processor (HTP) with Hexagon Vector eXtensions (HVX) and Hexagon Matrix eXtensions (HMX)
Qualcomm Secure Processing Unit for advanced secure use cases
Low Power AI (LPAI) subsystem with dedicated DSP and AI accelerator (eNPU) supporting always-on audio, sensors, contextual data streams, and Always-on camera.

Communication & Data Storage

Video UHD video processing unit
AV1 decode
Native decode support for H.265 Main 10, H.265 Main, H.264 High, and VP9 profile 2
Native encode support for H.265 Main 10, H.265 Main, H.264 high formats

Mechanical

Dimensions SOM Board: 40.27 x 33.41 mm LGA form factor
Weight 5 grams (without shield)

Other

Operating Environment [OE] Input Voltage: 3.6V Operating Temperature: -20 to +60 °C
Operating System [OS] OS – Linux LE (r76)

Storage

Storage 256GB UFS 3.1

Accessories

Media gallery

Deploying AI Object Detection, Target Tracking, and Computational Imaging on Embedded Processors
Maximize Perception with Prism ISP and AI Tools for Enhanced Thermal Imaging | SPIE DCS 2024
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