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High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module
Boson® +
Model: Boson Plus 320, 12° (HFOV) 18 mm
Made in the USA and ITAR free, the Boson+ sets the standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK. The upgraded automatic gain control (AGC) filter and new DDE+ deliver dramatically enhanced scene contrast and sharpness. Lower video latency enhances tracking, seeker performance, and decision support.
Overview
Product
Description
Documents
Downloads
Accessories
Description
Boson+ is a plug-and-play upgrade widely-deployed Boson and include optional factory-integrated continuous zoom lenses to streamline development and maximize performance. With customer-selectable USB, CMOS, or MIPI video interfaces, it is easier than ever to integrate Boson+ into a wide range of embedded processors from Qualcomm, Ambarella, and more. The user-friendly SDK, updated GUI, and comprehensive product documentation further simplify OEM integration for unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
Documents
Downloads
Accessories
Accessories
Downloads
Expansion Boards
Boson Camera Link Accessory Kit (421-0063-00)
Boson Development Board (250-0705-00)
Boson VPC (only) (500-0869-00)
Boson VPC Accessory w/ Analog (421-0062-00)
Boson VPC w/Cables (421-0061-00)
Optical Accessories
12V 4" Blackbody for Gain Cal & Supplemental FFC (285-0029-02)
Boson Lens Focus Tool (261-2609-00)
Mounts
Boson Tripod Mount Adapter (261-2608-00)
Cables
Boson VPC Cable (308-0271-00)
Brochure
Datasheet
IDD
Quick Start Guide
Tech Note
Note: You must be logged in to download software or firmware. Log in or create an account.
GUI
Software Download
STEP File
Highlights
Superior Performance, Faster Time to Market
Market-leading Thermal Sensitivity, Contrast, and Latency
NEDT of ≤20 mK extends detection, recognition, and identification (DRI) performance
Optimized Size, Weight,
and Power (SWaP)
Full-featured LWIR thermal camera module just 7.5 grams and less than 4.9 cm³
Designed for
Integrators
Shared mechanical, electrical, and video interface across all Boson models
Teal 2 sUAS Overview feat. Hadron 640R
THE TELEDYNE FLIR ADVANTAGE
Integrating Teledyne FLIR thermal camera modules is now easier with our library of how-to-videos, application notes, and our comprehensive support center with product drawings, datasheets, and more!
The Power of Boson
With nearly sixty models, the ITAR-Free Boson family represents the most dynamic, highest-performing uncooled thermal imaging technology in the Teledyne FLIR portfolio.
Boson Lens Selector Tool
3 easy steps to determine the best camera focal length for your application!
GUI 4.6.6 for Boson+
The Boson GUI provides the ability to quickly access radiometry settings critical to high-speed integration cycles, balancing schedule, cost, and performance.
Prism
The end-to-end computational imaging ecosystem that supports various AI-powered object detection and tracking capabilities and advanced image processing.
Specifications
| PARAMETERS | DESCRIPTION |
|---|---|
| Pixel Size | 12 µm |
| Frame Rate Options | 60Hz default; 30 Hz runtime selectable |
| Thermal Spectral Range | Longwave infrared; 8 µm – 14 µm |
Performance
| Thermal Spectral Range | Longwave infrared; 8 µm – 14 µm |
Imaging & Optical
| Array format | 320 × 256 |
| Digital Zoom | 1x to 8x zoom |
| f-number | 1.0 |
| Frame Rate Options | 60Hz default; 30 Hz runtime selectable |
| Image Orientation | Adjustable (vertical flip and/or horizontal flip) |
| Non-Uniformity Correction (NUC) | Factory calibrated; updated FFCs with FLIR’s Silent Shutterless NUC (SSN™) |
| Pixel Size | 12 µm |
| Scene Dynamic Range | to 150 °C (high gain) to 350 °C (low gain) |
| Snapshots | Full-frame snapshot via Boson GUI |
| Symbol overlay | Re-writable each frame; alpha blending for translucent overlay |
| Thermal Sensitivity | <20 mK (Industrial); <30 mK (Professional) |
Connections & Communications
| Control Channels | UART, USB or I2C |
| Peripheral Channels | I2C, SPI, SDIO |
| Video Channels | CMOS, MIPI or USB3 |
Electrical
| Input Voltage | 3.3 VDC |
| Power Dissipation | Varies by configuration; as low as 600 mW |
Mechanical
| Precision Mounting Holes | Four tapped M1.6×0.35 (rear cover) |
| Size (w/o lens) | 21 x 21 x 11 mm |
| Weight | 7.5 g without lens (configuration dependent) |
Environmental & Approvals
| Non-Operating Temperature Range | -50° C to 85° C |
| Operating Temperature Range | -40° C to 80° C |
| Operational Altitude | 12 km (max altitude of a commercial airliner or airborne platform) |
| Shock | 1,500 g @ 0.4 msec |
| Solar protection | Yes, when integrated with factory lens |
Export Designations
| ECCN Code | 6A003.b.4.b (Fast Video, 60Hz) 6A993.A (Slow Video, 9Hz) |
Related Content
Accessories
Media gallery
3rd Party Lens Calibration with FLIR Boson and Boson+
AGC Tuning with FLIR Boson and Boson+
MIPI Integration with FLIR Boson and Boson+
Setting Up Radiometry with FLIR Boson and Boson+
SPIE DCS 2023 – Boson+ CZ
Software Integration with FLIR Boson and Boson+
Video Interfaces with FLIR Boson and Boson+
Your Guide to Boson+ GUI 4.2
How to Interface with FLIR Boson and Boson+
